Monte Carlo implantation: 3D MC is provided; SiGe, SiC material are supported; Model for electronic stopping is rebuild; Algorithm for particle splitting is optimized; Algorithm for boundary condition is rebuild; Particle replication is supported.
Table implantation: Algorithms for lateral struggle is optimized; Format2 table is supported; Moments can be scaled or set directly.
A new mesh engine is provided.
PARAM_SET is upgraded. All possible parameters are open for modifying, however, some command (such as setmesh, setimplant) are deprecated. PLEASE DELETE THE DEPRECATED COMMAND. More detailed parameter setting command, please contact your AE.
Interpolation for oxidation speed on arbitrary surface orientation for both Silicon, SiliconGermanium and SiliconCarbide are supported.
EXTARCT fields for all point is supported. EXTARCT integrate is supported.
INITIALIZE and IMPORT can set and check the orthogonality of orientation and x_orientation.
IMPORT can control if the rec is loaded.
EXPORT can control if the interfaces are saved (contacts are always saved).
MASK: Generating 1d mask from gds file is supported.
POLYGON and POLYHEDRON support boolean operation.
CONTACT delete function is rebuild.
CLIP\FLIP\MIRROR are summarized in TRANSFORM command as type= clip\flip\reflect. However, the CLIP command is also supported.
TRANSFORM type= paste is supported in 2d mode; type= stretch is supported in 2d/3d mode.
Bug fixes:
Fixed SiGe MC implant bug.
EXTARCT integrate: Unit is corrected in field integration.
The 3D topo and mesh engine are continuously optimizing. More robust algorithm is provided.
3D analytic iso etch and deposit is provided, and will be used as default iso algorithm; if failed, levelset will be used as back-up.
The 3D mesh quality is improved.
REFINEBOX 3D provide growth_ratio, parallel_size function for type "interfacial".
2D Monte Carlo implantation is provided. Si, Ge, SiC and multiple amorphous materials are supported.
Implant table methodology is optimized.
Post-process is added for both MC and table implantation.
For convenience, the Silicon will converted to StrainedSiliconGermanium automatically in necessary processes.
Paramset format is changed for compatibility with other process modules.
SiGe and SiC oxidation are supported.
3D ox_grid_not_move in DIFFUSION is supported.
Add "lattice_factor" function to consider the lattice dislocation caused lattice mismatch relaxation.
PHOTO 3D is supported.
EXTRACT 3D is supported.
DEPOSIT / DISPLACE with vertex / element fields are supported.
LOAD_PROFILE is supported.
More function for 3d contact definition.
Mask from gds is supported.
Bug fixes:
3D surface interpolation is corrected.
Implantation bugs are corrected.
3D directional etch.
Mesh repeatability.
VisualTCAD Device Simulator
New features:
Add HOOK plt function to extract specific physical field information from each step of the simulation for calculation
Add OUTPUT Variables function to filter output physical field information
Update Coulomb2D mobility model to include interface trap impact
Add piezoresistance mobility model
Bug fixes:
Fixed can’t modify parameter of TCLCO.
Fixed the incorrect amplification factor of Z.width in 3D simulation.
VisualTCAD Workbench
New features:
Add file filtering to the file selection area, involving: Visualize, Project & Cell Cleanup.
Step, Module, Parameter support for pasting forward/backward.
Optimize the status display when copying a running project into a new project.
Import experiments support for selecting multiple Nulls.
Cell find supports regular and exact matching.
Cell Explorer context menu allows for multi-selection and filtering of file directories.
When deleting Values under Filter, it should not affect all experiments.
Support editing parameter to add comments.
Project tree support to drag and cut.
Optimize the state dispaly after the project copy.
Optimize cleaning project, support to filter and delet output files.
VisualTCAD Visual
New features:
Adjustments for the axial and free orientation of 2D/3D Cutline, when set to plot on the same graph, should unify the operational dimensions (either individual axial or free) to plot them together on the same graph.
Add unit display to the Field and Legend in 2D/3D Plot.
Data processing for the modulus of 2D/3D vector data.
Scalar component splitting for 3D vector data.
Update Material configuration does not show the activated field except Insulator, Resistance, Conductor, Vaccum. The others display the activated field.
Optimize tdr, tar file parsing.
Open the suite documents when click the Help.
VisualTCAD RCEx
New features:
Add lump function,merge multiple conductor blocks into one to solve.
Adjustments to the mesh volume checking rules now ignore tetrahedral meshes with zero volume in the input geometry.
Demo for 3d process simulation is coming. Basic etch, dep, mesh, analytic implantation, diffusion are supported. Please refer to the 3d demo template.
2d coordinate system change to X-Z due to compatibility with 3D: right is X+, up is Z+(changed from Y- to Z+). All the vertical coordinates shall be inverted. We do apology that this update will cause compatibility problems for the old script.
VisualTCAD Process has new file format: “tar”. This format is actually a compressed file, and it stores many process simulation settings. Thus, some old regulations can be removed.
Some commands are changed due to compatibility with 3d, such as “effective_rectangle” will be changed to “effective_box”, “effective_rectangle” is deprecated while still works.
2d refinebox capability enhanced: normal mesh refine with more effective growth_ratio; can use mask to define refinebox.
2d contact capability enhanced: effective_box for all contact strategies; can use mask to define contact.
VisualTCAD Process will support simultaneous oxidation for O2, H2O and N2O. However, the N2O will cause only oxidation not nitridation.
The field in the interface can be stored in output file.
Bug fixes:
The surface dose loss is too much.
Wafer orientation and other process information are not passed to next module.
Oxidation speed with little H2 is not correct.
The diffusion will dump if time is not stated.
The mirrored refinebox is not passed to next module.
VisualTCAD Device Simulator
Bug fixes:
Fixed nonlocal tunneling current calcul ation for hole.
Fixed an-isotropic electrical permittivit y for LiNbO3 material.
Fixed physical unit of Okuto model when power of driving force is not equal to 1.0.
Fixed crash problem for displacement damage solver.
VisualTCAD Workbench
New features:
Check the permissions on directories,when create the project.
Show the lock identifier,when a step or module is locked.
Optimize the run limit configuration max_jobs.
Project tab add the right-click options(Copy Full Path, Open Folder in System, Open Terminal Here).
Support [Refresh All] in Project Tree.
Support [Collapse All] in Project Tree.
Support enable experiments matching,when adding filter.
Search parameters,values,and cells.
Optimize Append Values.
Insert after the last Step,the view automatically moves to the right.
Optimize Explorer Performance.
Optimize cell explorer text search.
Optimize preprocess.
Bug fixes:
After the project compressed package fails to be imported, the file with the same name is deleted.
The project status is abnormal (always finished).
Exit and restart,the previously folded root folder is expanded again.
VisualTCAD Visual
New features:
Added enhanced search functionality for Field, Variable, Material, and more.
Added support for bnd and tar file format.
Optimized logic for plotting band.
Optimized initial window position for the application.
Bug fixes:
Fixed a crash issue when plotting 1D large data curves.
VisualTCAD Structure
New features:
Provide examples for finfet, nanosheet, dram in wb applications library.
Improve some python api for convenience.
Bug fixes:
Correct bnd quality.
VisualTCAD RCEx
New features:
The -D prefix is no longer required when specifying a DF-ISE file, only the file name is given, and the lepton solver can detect the file type (TDR/DF-ISE) by itself.
The usage of the parameters has been corrected to “-OPTION PARAMETER”, that is, there must be a space between the parameter name and the parameter.
"PARAM_SET" command to modify the diffusion parameters and diffusion factor.
SiC activation model: time-dependent moment1 model withhigh reaction speed.
Mesh flip to same direction.
Region merge function.
Can specify certain material during CMP etch.
Add temporary material for deposit and etch.
More parameters to control diffusion time step.
Bug fixes:
Correct OED effect for long time oxidation.
Correct continuous boundary at multipleregions intersection point.
Correct long time low-temperature diffusion.
VisualTCAD Device Simulator
New features:
Enable Fermi distribution in fast transient solver, which is able to simulate device with millions of mesh nodes.
Simulator is tolerant of degenerated mesh elements, i.e. flat tetrahedron with zero volume.
Enable solder pad boundary embedded in the structure.
Bug fixes:
Fix a conservation issue in AC current which may cause an capacitance error around 1%.
Fix mobility issue of several materials when doping concentration is zero.
Fix solver with quad-double precision crash at parallel environment.
Fix an inaccurate issue of expm1 derivative evaluation.
VisualTCAD Workbench
New features:
When a job is running, variables need to be extracted from the standard output of the job, no matter whether the job succeeds or fails in the process.
When the input configuration of the tool has no label information, the project configuration of the tool is not displayed in the edit input menu.
Support for modifying filter name.
Support the selection of run queues.
When adding Step, Module, or parameter, the function “apply” that allows for continuous addition.
The parameter values are similar to the numerical processing of 1, 1.0 1.0e0.
The Clean up Cell page supports Clear cell Files.
After the node is selected, preprocessed or deleted, the experiment still keeps the node selected.
Support Step, Module, Parameter copy, cut, paste.
When the Cell explorer is closed, the location and size are remembered. The next time cell explorer is opened in the original location.
Optimize the Cell explorer search style ,open the search box for text files by default.
Support selecting multiple cells to open and delete files.
Cell Explorer supports filtering files.
Support file type filtering ,when opening the visualization dialog.
Add create_ Link function. Only effective when preprocess=false.
Logs hide input file information that does not need to be preprocessedc.
Merge run configuration to tool configuration, adding mruncfg information by default.
Bug fixes:
After selecting experiment save as project, the original project with modifications is directly closed, and the user needs to be prompted whether to save the modifications.
The selected cell is not maintained after you clean up the cell by using the title menu bar, toolbar, or Ctrl+D shortcut.
When there is a blank line before the first module, the system reports a warning during preprocessing.
VisualTCAD Visual
New features:
Supported Sorting of One-Dimensional Curves.
Expanded support for 1D PLX data sets.
Supported customizable ticks positioning on 1D axis.
Supported display and control of 2D grids.
Optimized opening of DFISE files.
Introduction of "remove_plot" command.
Supported custom integration ranges.
Bug fixes:
Optimized return value on execution failure.
Fixed an issue with 3D rotation around an axis.
VisualTCAD Structure
New features:
Provide multiple applications examples.
Bug fixes:
Return value of main function.
Region rename after splitting.
Region rename when importing sat file.
VisualTCAD RCEx
New features:
Solve the Laplace equation on a tetrahedral finite element grid.
The capacitance between conductors is calculated in the dielectric area, and the resistance between the boundary port (including the user setting port) is solved inside the conductor.
Read-in geometry and tetrahedral finite element mesh data , support Cogenda VisualTCAD Structure/Process DF-ISE format.
Output contains capacitance matrix data, resistance matrix data, and a parasitic RC netlist assigning capacitance values in resistance ports.
Electric field data including electrostatic potential(scalar) , electric field (vector), current density (vector), and conductivity (scalar) is optional for output.
VisualTCAD RCEx supports the setting of the interface surface resistivity on the boundary surface between conductors in the resistance calculation, and supports the three models of conductor conductivity modeling.
Support the capacitor/resistance distributed extraction function based on structure space segmentation.
Add new material LiNbO3 with an-isotropic dielectric coefficient.
Add PWL support for vsource and isource.
Support small signal AC sweep for optical generation.
Improved initialize speed of distance-to-surface.
Bug fixes:
Fixed dopant naming for SiC material.
Fixed convergence test of MIX solver.
Avoid crash when stress PMI not exist.
Mozz Process Simulator
New features:
SiGe Diffusion model: mole-fraction parameter interpolation, coupling stress and diffusion.
More materials supported in diffusion: HfO2, TiNitride, TiSilicide, SiC.
Faster dynamic compiling.
PAI co-implant model.
Bug fixes:
More stable diffusion.
Mozz Workbench
New features:
Optimize example applications generation.
Optimize the display of project directories when opening and saving projects.
Support top the root directory of the project tree.
Improve the copy operation in the project tree.
Add a running status display for project trees.
Support cleaning up non-existent Cell folders and Step input files in projects.
Support project reloading.
Display a prompt for duplicate file names when adding Flow Steps.
Automatically include names when adding steps.
When selecting multiple experiments to append value, the new experiment will only be added based on these selected experiments.
When adding experiments based on parameter values, locate the parameter nearby for easy editing.
Operations under Filters will only take effect within the scope of the Filter.
When running a Cell, execute the settings related to dependencies.
When using slurm scheduling, no longer generate slurm.sh files.
Prompt for occupied files during clean up and perform continuous deletion.
Switch the explicit merging of cells in the table.
Cell information switching displays runtime, server information, JobID, dependencies, etc. and can be quickly accessed with shortcut keys.
Quickly select operations using the selected cell.
Quickly select experiment cells.
Optimized performance and querying of Cell Explorer text filtering .
Cell Explorer supports opening visualization tools for multiple selections with the same format.
Cell Explorer remembers the previous location of opened files.
Project Explorer/Cell Explorer file system directory displays file list sorting optimization.
Cell Explorer supports deleting multiple selected files.
Cell Explorer supports displaying file directories.
Optimized Visualizer prompts.
Supports running visualization scripts after preprocessing, and displaying multiple items in the order selected by cells from left to right and top to bottom.
Optimized performance of preprocessing.
Preprocessing python expressions supports nesting with @[].
Preprocessing macro definitions support parameter passing and multi-line macros.
If the tool has modules, the save and load cmd of the command should be added.
Preprocessing reference @() supports nesting.
Added configurations for empty columns and rows.
Added configurations for opening tools in system folders.
Mozz Visual
New features:
Enhanced Plot Sorting and Hiding.
Improved Axis Zooming in One-Dimensional Plots.
Extended Element Visualization for Scalar and Vector Data.
Optimized Calculation Speed for Integration, Maximum, and Minimum Value.
Mozz Structure
New features:
More capability to build and edit the structures.
Provide the script macro recording function for main operations. User can load this macro in later use.
Bug fixes:
GUI breakdown.
Mozz Extract
New features:
Plenty of data operation functions.
Several robust optimization algorithm.
Binning support of the extracted models.
Supports RSM analysis of the extracted spice models.
Enhanced support of thermal effect, update DDML2/DDML2QF solver and QDDML2A quantum correction solver.
Support Schenk, Hurkx and modified Hurkx BBT model.
Support VanOverstraeten and Okuto avalanche model.
Optimized simulation speed, the simulation time reduced 10-30%.
Bug fixes:
Fixed Ohmic and Schottky boundary consistence with incomplete ionization.
Fixed Schottky boundary thermal equilibrium carrier density consistence with BGN.
CONTACT electrode potential now equal to Vapp-Workfunction, compatible with other TCAD tools.
VisualTCAD
New features:
Change the display style in the "field" show mode of the 2D Visual window when field range is set to "out" in the "Struct Property" dialog.
Add variable edit dialog in Advance menu of 2D Visual window, which can edit values of scalar, tensor, vector and alias. These variables can be used as CV2D module's default configure.
The default colors of cutline changed.
The colors of cutline in CV2D now have dark-theme and light-theme, that will change by background color automatically.
Change the cutlines default width to 1.5.
Bug fixes:
When inputting space in CV2D Variable Edit window, clicking save button, VisualTCAD will core dump.
The cutline white&black color RGB value is contrary to the requirement design in CV2D Variable Edit window.
For some kind of .vtu file , the probe data shows nil when using probe tool.
CV2D Variable Edit window will close when click enter key in input box of the column head.
right click the cutlinecolor-white box in CV2D Variable Edit window should popup the insert row/column options.
Fix geometry issue to avoid creating very small regions.
Genius Device Simulator
New features:
New drift-diffusion solver DDML1QF which based on quasi-fermi potential instead of carrier density, which provides more accuracy resolution to off current.
New density-gradient based quantum effect solvers for advanced FDSOI and FinFET.
New Mobility models for MOS, FDSOI and FinFET.
Re-implemented small signal AC sweep solver for both classic and quantum effect drift-diffusion solvers.
Add material property support for silicon photonics.
Add carrier density export function with Matlab® V5 file format.
Bug fixes:
Improve C1 discontinuity of fermi function, improved convergence when fermi flag is on.
Fix convergence criteria when avalanche is on, avoid fake solution at breakdown point.
Fix AD error of half implicit solver which may cause current oscillation at large time step.
VisualTCAD
Bug fixes:
The saved file name of Schematic isn't shown on the Circuit Schematic window.
The Vector of electrical_field[V/cm] can't be plotted correctly.
Application quit automatically when Load from TIF file twice on a new Device Drawing window.
The system does not jump to the corresponding page that has been opened when Click "Show IV Data".
Fixed miscellaneous bugs in mixed-mode transient simulation.
Improved imcomplete ionization model support in SiC materials.
VisualTCAD 1.8.2-8
2015.9.20
Genius Device Simulator
Bug fixes and improvements
Improved convergence of TID solver.
Fixed a bug in SiC Masetti mobility model.
Fixed numerical round off problem about cylinder mesh generator CY2D and CY3D.
Fixed a bug in mixed-mode simulation when "solderpad" boundary is in contact with an insulator material region.
Fixed a bug in mixed-mode simulation where two sequential transient simulations suffers from a discontinuity in node voltage.
Support export of SPICE device internal state variables along with nodesets, so mixed-mode transient simulation can be restarted from a previously saved state without discontinuity.
Improved auto time step control of mixed-mode simulation.
WebTCAD is the web version of Cogenda's VisualTCAD, a powerful tool of TCAD process and device simulation. It's mainly designed for teaching purpose, aimed at demonstrating/simulating industry-standard semiconductor fabricating and working process. The intuitive graphic UI, step-by-step workflow, and fully featured post process ability make it much easier for university teachers and students to use.